硅(gui)(gui)-藍(lan)輝(hui)石(shi)(shi)(shi)由單晶硅(gui)(gui)接地體(ti)成分組(zu)合，不(bu)(bu)想會出(chu)現的(de)時滯、乏力和(he)(he)脆性(xing)(xing)(xing)(xing)斷裂干涉現象；藍(lan)輝(hui)石(shi)(shi)(shi)有(you)相當好(hao)的(de)優(you)質的(de)配置和(he)(he)接地優(you)點（1000℃以下(xia)），對(dui)溫濕(shi)度(du)轉(zhuan)(zhuan)變不(bu)(bu)銘(ming)感(gan)，盡管在溫度(du)因素(su)下(xia)，有(you)著挺好(hao)的(de)事情優(you)點；藍(lan)輝(hui)石(shi)(shi)(shi)的(de)抗輔射優(you)點強得；同時，硅(gui)(gui)-藍(lan)輝(hui)石(shi)(shi)(shi)半導(dao)體(ti)技術(shu)銘(ming)感(gan)電(dian)子器(qi)(qi)件，無p-n漂移，對(dui)此，可APP于(yu)各樣繁(fan)雜大環境場(chang)所。感(gan)應(ying)器(qi)(qi)器(qi)(qi)由雙膜片(pian)帶來(lai)：鈦(tai)不(bu)(bu)銹鋼(gang)(gang)檢(jian)(jian)測(ce)(ce)的(de)膜片(pian)和(he)(he)鈦(tai)不(bu)(bu)銹鋼(gang)(gang)收(shou)膜片(pian)。數碼打印(yin)有(you)異質本質性(xing)(xing)(xing)(xing)應(ying)力靈敏性(xing)(xing)(xing)(xing)電(dian)橋電(dian)路系(xi)統(tong)板(ban)的(de)藍(lan)輝(hui)石(shi)(shi)(shi)膜片(pian)，被(bei)熔焊在鈦(tai)不(bu)(bu)銹鋼(gang)(gang)檢(jian)(jian)測(ce)(ce)的(de)膜片(pian)上(shang)。被(bei)測(ce)(ce)學習(xi)各種(zhong)(zhong)壓力值(zhi)傳到收(shou)膜片(pian)上(shang)。在學習(xi)各種(zhong)(zhong)壓力值(zhi)的(de)反(fan)應(ying)下(xia)，鈦(tai)不(bu)(bu)銹鋼(gang)(gang)收(shou)膜片(pian)產生塑性(xing)(xing)(xing)(xing)塑性(xing)(xing)(xing)(xing)變形(xing)，該塑性(xing)(xing)(xing)(xing)塑性(xing)(xing)(xing)(xing)變形(xing)被(bei)硅(gui)(gui)-藍(lan)輝(hui)石(shi)(shi)(shi)銘(ming)感(gan)電(dian)子器(qi)(qi)件觸覺后，其(qi)電(dian)橋打出(chu)會會出(chu)現的(de)轉(zhuan)(zhuan)變，轉(zhuan)(zhuan)變的(de)頻(pin)率與被(bei)測(ce)(ce)學習(xi)各種(zhong)(zhong)壓力值(zhi)不(bu)(bu)成比(bi)例。電(dian)橋電(dian)路系(xi)統(tong)板(ban)將(jiang)電(dian)橋的(de)非均衡(heng)4g預(yu)警，轉(zhuan)(zhuan)換成為電(dian)流電(dian)壓4g預(yu)警打出(chu)。